Parker Chomerics CHO-BOND 1019 is a silver-plated aluminum filled, two-component electrically conductive polythioether designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding.
CHO-BOND 1019’s custom formulated polythioether polymer system offers excellent fluid and fuel resistance to jet fuels, de-icing solutions, hydraulic fuels and more. It is also silicone-free, removing any silicone contamination concerns while also being easily paintable – eliminating the need and cost of an additional primer application.
CHO-BOND 1019’s silver-plated aluminum filler provides excellent corrosion resistance and is designed for galvanic compatibility with aluminum substrates. Because of this, CHO-BOND 1019 is galvanically compatible with Parker Chomerics CHO-SEAL ® 1298 silver-aluminum filled silicone and CHO-SEAL 1285 silver-aluminum filled fluorosilcone gaskets.
CHO-BOND 1019 cures to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. It has been qualified on hexavalent chromium IAW MIL-DTL-5541 Class 1A and trivalent chromium IAW MIL-DTL-5541 Type II Class 3 in harsh conditions including heat, humidity, and salt fog where it maintains stable EMI shielding performance.
Overcoat adhesion qualified with MIL-PRF-23377 Type II Class N and Mil-DTL-53022 Type II epoxy primers. Minimum recommended bond line for CHO-BOND 1019 is 0.010 inches (0.25mm).
• Polythioether system ideal for harsh environments where fluid and fuel exposure is a concern
• Galvanically compatible to aluminum substrates