Polymer sealant CHO BOND® 4669

single-component

Parker Chomerics CHO BOND® 4669 is a one-component, silver-plated copper filled conductive sealant specifically formulated for extended working life and flexibility in applications where vibration resistance is required. CHO BOND® 4669 is a gray-colored material that possesses identical properties of CHO BOND® 4660 except for an enhanced working life. Features and Benefits: • Good conductivity levels (0.080 ohm-com) • No corrosive by-products generated during drying • No primer required • Excellent impermeability to gases • Minimal weight added to assembly due to lightweight material • Easily dispensed using a standard caulking gun • 2 hour working life for applications flexibility Typical Applications: • Access panels • Shielded room joints • Temporary military shelters • Hardware • Bulkhead feed-through fittings • Building conduits