Butyl rubber adhesive sealant CHO BOND® 4669

butyl rubber adhesive sealant
butyl rubber adhesive sealant
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Chemical composition
butyl rubber
Number of components


Parker Chomerics CHO BOND® 4669 is a one-component, silver-plated copper filled conductive sealant specifically formulated for extended working life and flexibility in applications where vibration resistance is required. CHO BOND® 4669 is a gray-colored material that possesses identical properties of CHO BOND® 4660 except for an enhanced working life. Features and Benefits: • One-component system so no mixing or measuring required • Good conductivity levels (0.080 ohm-com) • No corrosive by-products generated during drying • No primer required • Excellent impermeability to gases • Minimal weight added to assembly due to lightweight material • Easily dispensed using a standard caulking gun • 2 hour working life for applications flexibility Typical Applications: • Access panels • Shielded room joints • Temporary military shelters • Hardware • Bulkhead feed-through fittings • Building conduits


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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.