Multilayer printed circuit board P1.255 layers6 layers8 layers
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Characteristics
- Options
- multilayer
- Number of layers
- 2-layers, 8 layers, 4-layers, 6 layers, 3 layers, 5 layers
Description
Substrate Material
FR-4
Process Characteristics
High Density P1.25-P2.5
Board Thickness/Copper Thickness
1.2-2.0mm/35um
Surface Treatment
OSP/ENIG,etc.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.