Diamond wire

Product overview
Annular diamond wire is an annular cutting tool manufactured by electrodepositing diamond abrasive onto a steel or tungsten ring wire with nickel as binder. It is intended for precision cutting of hard, brittle materials with high efficiency, notably monocrystalline and polycrystalline silicon cropping/squaring in photovoltaic production, as well as graphite, sapphire and other hard-brittle substrates.

Key features

• Electrodeposited diamond abrasive bonded on annular steel or tungsten wire
• Available diameters: 380 μm, 420 μm, 500 μm, 650 μm, 800 μm
• Diameter tolerance: ±50 μm
• Tungsten ring-wire variants to reduce cutting loss and cost
• Customization and R&D support to meet process requirements

Product specifications (examples)

• 800 μm annular wire — diameter 800±50 μm; breaking force >410 N; tensile strength ≈810 N/mm²; typical use: graphite processing
• 650 μm annular wire — diameter 650±50 μm; breaking force >260 N; tensile strength ≈780 N/mm²; typical use: graphite processing
• 500 μm annular wire — diameter 500±50 μm; breaking force >230 N; tensile strength ≈1120 N/mm²; typical use: crystal silicon cropping/squaring
• 420 μm annular wire — diameter 420±50 μm; breaking force >210 N; tensile strength ≈1240 N/mm²; typical use: crystal silicon cropping/squaring
• 420 μm tungsten ring-wire — diameter 420±50 μm; breaking force >230 N; tensile strength ≈1490 N/mm²; typical use: crystal silicon cropping/squaring
• 380 μm tungsten ring-wire — diameter 380±50 μm; breaking force >190 N; tensile strength ≈1372 N/mm²; typical use: crystal silicon cropping/squaring

Applications and ordering

• Main applications: photovoltaic wafer cropping/squaring, graphite and semiconductor slicing, sapphire processing and other hard-brittle material cutting
• Selection guidance: choose diameter and wire material based on target material, required surface finish and line speed
• Supply options: standard diameters available; custom diameters and bonding specifications available on request