Chamfering tool

Product introduction
Diamond grinding wheels designed for grinding, polishing and chamfering monocrystalline silicon rods. Compared with conventional tools, these diamond wheels provide higher abrasive hardness and sharper grains, resulting in increased material removal rates, improved machining efficiency, longer service intervals and stable dimensional accuracy.

Product parameters
Category — Specifications/mm (diameter φ × thickness T × bore H) — Key features
Grinding cutters for monocrystalline silicon ingots (Rough) — φ250×T60/62×H38.1; φ300×T60/62×H52 — High-speed, high-efficiency grinding; no trimming required; high material removal rate; long service life.
Grinding cutters for monocrystalline silicon ingots (Finish) — φ250×T60/62×H38.1; φ300×T60/62×H52 — High-speed, high-efficiency grinding; high surface precision; long service life.
Grinding cutters for monocrystalline silicon ingots (End face) — φ250×T60×H80 — High-speed, high-efficiency grinding; no trimming required; high material removal rate.

Related products (examples)
GC-MJ908R Monocrystal Cropper; GC-KM202 Monocrystal Squaring & Grinding Machine; GC-GP950L Monocrystal Grinder; GC-800XC Diamond Wire Crystal Silicon Slicer.

Characteristics / Technical specifications

• Main application: grinding, polishing and chamfering of monocrystalline silicon rods of various sizes.
• Abrasive: diamond — high abrasive hardness and sharp grains.
• Performance: high material removal rate and high machining efficiency.
• Durability: high hardness, low wear, long dressing intervals and extended service life.
• Accuracy: good form retention and high machining precision.
• Thermal behaviour: good thermal conductivity and low grinding temperature for stable processing.
• Available categories and sizes: Rough, Finish and End-face grinding cutters with specifications listed above.