Diamond wire

Product description
Specialized electroplated diamond wire designed for slicing sapphire with high stability and cutting efficiency. The wire exhibits reduced breakage due to enhanced toughness and improved abrasion resistance. An integrated automatic control system minimizes abrasive volume fluctuation to ensure consistent cutting and uniform abrasive distribution. Production runs under high-definition monitoring for traceability.

Product parameters
Spec. & Model | Diameter of Finished Wire (mm) | Breaking Force (N) | Purpose
0.16 Electroplating diamond wire | 0.16±0.01 | ≥30 | Sapphire slice
0.18 Electroplating diamond wire | 0.18±0.01 | ≥45 | Sapphire slice
0.20 Electroplating diamond wire | 0.20±0.01 | ≥55 | Sapphire slice
0.22 Electroplating diamond wire | 0.22±0.01 | ≥70 | Sapphire slice
0.23 Electroplating diamond wire | 0.23±0.01 | ≥75 | Sapphire slice
0.25 Electroplating diamond wire | 0.25±0.01 | ≥90 | Sapphire slice

Features / technical specifications

• Available diameters: 0.16, 0.18, 0.20, 0.22, 0.23, 0.25 mm (electroplated)
• Finished wire diameter tolerance: ±0.01 mm
• Breaking force (N): ≥30; ≥45; ≥55; ≥70; ≥75; ≥90 respectively
• Application: sapphire slicing
• Process control: automatic control system for uniform abrasive distribution and consistent cutting
• Manufacturing: produced under HD monitoring for traceability; special treatment improves wire toughness and wear resistance