Loop tester CP-5000

temperatureflowfriction

CMP Tester for R&D controlled polishing, effective process development, and polishing materials testing. Main Features: Real-Time Coefficient of Friction Controlled Down Force and Speed Integrated 3D profilometer Several wafer sizes can be mounted In-line Temperature and Acoustic Emission to study process Advance your process and product development with our CMP R&D polisher. We optimized product development by providing several polishing processes on one platform. These processes include a wide speed range, closed-loop downforce control, versatile wafer holders, and an automatic slurry delivery system. Additionally, the CMP tester monitors several in-line signals during the polishing process. Besides polishing wafers & substrates, the tester comes with an in-line surface profilometer. This combination explains how the surface, friction, and surface wear changed and why imperfections occur. Features Unmatched Load Cell Technology and Speed During the polishing process, high resolution in-line force measurements quantify interfacial interactions. To optimize the process, the CP-5000 provides full control of down force. This includes speed and flow rates based on customized test protocols. Pad Conditioner Self-leveling upper pad conditioner holder with both active rotation and horizontal oscillations. Accommodates conditioner from 0.5 “to 4.25” Reliable and Accurate Each CMP Tester is versatile with many sensors and temperature options. The motorized XY stage comes with fast exchange, providing meaningful data with ease. Ease Of Use The CP-5000 comes with Fast Exchange carriers. As a result, quick and easy mounting of wafer and pads is achieved.