Data connector oHFM™

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Overview
Open Harmonized FPGA Modules (oHFM) is a combined approach for low- to high-range FPGA Modules with solderable and connector-based embedded System-on-Modules (SoMs). The oHFM.c connector-based SoMs are designed for high-speed operation (up to 112 Gbps PAM4 data rates), scalability, and straightforward upgrades. oHFM.c Modules support FPGA-only implementations and CPU + FPGA integration, with four base form factors and four extended variants that add 20 mm to module length (10 mm at each end) to provide additional PCB area for increased component density.

Form Factors

• Size-S - “Small”: 75 mm x 50 mm (extended: 95 mm x 50 mm)
• Size-M - “Medium”: 75 mm x 70 mm (extended: 95 mm x 70 mm)
• Size-L - “Large”: 75 mm x 90 mm (extended: 95 mm x 90 mm)
• Size-XL - “Extra Large”: 75 mm x 120 mm (extended: 95 mm x 120 mm)

Connectors
oHFM™ Connectors are high-performance 320-pin arrays. The module-side connector is a receptacle (female) mounted on the module PCB bottom side; the carrier-side connector is a plug (male) mounted on the carrier PCB top side. Female module receptacles are employed at a standard height; male carrier plugs vary to provide either a 5 mm or 10 mm stack height.

• Module connector designations: J1, J2, J3, J4.
• Carrier connector designations: P1, P2, P3, P4.
• Size-S Modules: use two 320-pin receptacles (J1/J2) with row pitches 0.96 / 1.5 / 0.96 mm and column pitch 0.635 mm (J2 optional).
• Size-L Modules: add a 320-pin receptacle (J3) with row pitches 2.2 / 2.4 / 2.2 mm and column pitch 0.635 mm.
• Size-XL Modules: add a 320-pin receptacle (J4) with row pitches 2.2 / 2.4 / 2.2 mm and column pitch 0.635 mm.
• Data-rate support: Size-S connectors support up to 64 Gbps PAM4 (derived from Samtec AcceleRate® HD); Size-L and Size-XL connectors support up to 112 Gbps PAM4 (derived from Samtec AcceleRate® HP).

oHFM™ Connectors - Summary Table
Samtec PN | Module Receptacle | Carrier Plug | Stack Height | Termination | Weld Tabs | Plating | Prints | 3D | PADS
ASP-240412-01 | J1/J2 | (module receptacle only) | (varies) | Column termination | X (weld tabs) | -L plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-240412-02 | J1/J2 | (module receptacle only) | (varies) | Column termination | X (weld tabs -S variant) | -S plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-240413-01 | (module receptacle) | P1/P2 | 5 mm | Column termination | X | -L plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-240413-02 | (module receptacle) | P1/P2 | 5 mm | Column termination | X ( -S variant) | -S plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-242870-01 | (module receptacle) | P1/P2 | 10 mm | Column termination | X | -L plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-242870-02 | (module receptacle) | P1/P2 | 10 mm | Column termination | X ( -S variant) | -S plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-240410-01 | J3/J4 | (module receptacle) | (varies) | Column termination | X | -L plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-240410-02 | J3/J4 | (module receptacle) | (varies) | Column termination | X ( -S variant) | -S plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-240411-01 | (module receptacle) | P3/P4 | 5 mm | Column termination | X | -L plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-240411-02 | (module receptacle) | P3/P4 | 5 mm | Column termination | X ( -S variant) | -S plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-242868-01 | (module receptacle) | P3/P4 | 10 mm | Column termination | X | -L plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available
ASP-242868-02 | (module receptacle) | P3/P4 | 10 mm | Column termination | X ( -S variant) | -S plating | PDF Print available | IGES / PARASOLID / STEP available | PADS File available

Standoff Hardware - Summary Table
Samtec PN | Application | Material | Thread Pitch | Module Stack Height | Prints | 3D | PADS
ASP-230558-01 | JSOM Assembly | Stainless Steel | M2.5 | 5 mm | PDF Print available | STEP available | PADS File available
ASP-230565-01 | Standoff Assembly | Stainless Steel | M2.5 | 5 mm | PDF Print available | STEP available | PADS File available
ASP-222919-01 | JSOM Assembly | Stainless Steel | M2.5 | 10 mm | PDF Print available | STEP available | PADS File available
ASP-222923-01 | Standoff Assembly | Stainless Steel | M2.5 | 10 mm | PDF Print available | STEP available | PADS File available

Caractéristiques / Spécifications techniques

• Module base sizes: Size-S, Size-M, Size-L, Size-XL; extended variants add 20 mm to module length.
• Typical module dimensions: 75 mm x 50/70/90/120 mm (extended: 95 mm x 50/70/90/120 mm).
• Connector contact density: 320-pin high-performance arrays per connector position.
• Row/column pitch examples: Size-S row pitches 0.96 / 1.5 / 0.96 mm; column pitch 0.635 mm. Size-L / XL row pitches 2.2 / 2.4 / 2.2 mm; column pitch 0.635 mm.
• Data-rate capability: Size-S up to 64 Gbps PAM4; Size-L and Size-XL up to 112 Gbps PAM4.
• Connector orientation: Module receptacles (female) mounted on module bottom; carrier plugs (male) mounted on carrier top.
• Stack heights supported: 5 mm and 10 mm carrier plug variants; female module receptacles at standard height.
• Available resources: PDF prints, 3D models (IGES / PARASOLID / STEP), and PADS layout files for listed part numbers.