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EDGE PC Palladio 400 RPL
Edge AIAIembedded

EDGE PC - Palladio 400 RPL - SECO - Edge AI / AI / embedded
EDGE PC - Palladio 400 RPL - SECO - Edge AI / AI / embedded
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Characteristics

Type
Edge AI, EDGE, AI
Configuration
embedded
Processor
Intel® Core i5, Intel® Core i7, Intel® Core i3, Intel® Core™ i9, 13th Generation Intel® Core™
Ports
RS-485, DisplayPort, RS-232, 2.5 GbE, Ethernet, RS-422, USB 3.2, SATA, M.2, PCI Express, SIM card
Data storage
SSD 128GB, SSD 256GB
Operating system
Linux, Windows
Size
compact
Other characteristics
fanless, modular, wireless, PoE
Memory
32 GB

Description

Overview
Modular fanless embedded industrial PC designed for edge and AI applications, based on 13th Gen Intel® Core™ processors with multiple expansion options and rugged operating ranges.

Highlights
  • CPU: 13th Gen Intel® Core™ i3 / i5 / i7 / i9 (Raptor Lake‑P)
  • Graphics: Up to Intel® UHD Graphics 770 (CPU dependent)
  • Memory: Up to 32 GB SO‑DIMM DDR4 2666
  • Video: 2x DisplayPort, up to 4K @60 Hz


Security & Compliance
Built‑in Secure Boot for platform integrity, optional TPM and PTT BIOS settings, watchdog timer, secure OTA updates and Yocto‑based secure OS integration. Compliance documentation available for applicable standards (EN18031‑1 referenced).

Product details
Compact, modular design with multiple M.2 and SATA storage options, ModBay expansion slots and industrial I/O for AI and automation deployments at the edge. Flexible networking with dual 2.5 GbE (PoE optional) and optional M.2 Wi‑Fi/BT module.

Technical specifications
  • Model: Palladio 400 RPL
  • CPU options: i3‑13100E / i3‑13100TE / i5‑13500E / i5‑13500TE / i7‑13700E / i7‑13700TE / i9‑13900E / i9‑13900TE (see variant details for frequencies, cores/threads and TDP)
  • Memory: Up to 32 GB SO‑DIMM DDR4 2666
  • Graphics: Up to Intel® UHD Graphics 770
  • Storage: Up to three M.2 2280 (SATA / PCIe Gen4 x4) plus 2x 2.5" SATA (optional hot‑swap)
  • Networking: 2x 2.5 GbE LAN (PoE optional), optional Intel® M.2 2230 802.11ac Wi‑Fi + BT 5.1
  • I/O: 6x USB 3.2 Gen 2, 1x 3.5 mm audio, 2x COM RS‑232/422/485, GPIO (DIO, CAN), 2x 3FF Micro‑SIM
  • Power: 12–48 VDC (20–48 VDC with high‑power PCIe expansions)
  • OS: Compatible with Linux and Windows; Yocto‑based secure OS available
  • Operating temp.: -40°C to 70°C (with 35W CPU); -40°C to 50°C (with 65W CPU)
  • Dimensions: 240 x 82 x 267 mm


Variants / Part numbers (examples)
  • SF‑K840‑RPL‑01‑00 — Intel Core i3‑13100TE, TPM 2.0, 2x 2.5 GbE, 2x8 GB DDR4 2666, 128 GB M.2 SATA SSD, Wi‑Fi/BT 5.1
  • SF‑K840‑RPL‑02‑00 — Intel Core i5‑13500TE, TPM 2.0, 2x 2.5 GbE, 2x8 GB DDR4 2666, 128 GB M.2 SATA SSD, Wi‑Fi/BT 5.1
  • SF‑K840‑RPL‑03‑00 — Intel Core i7‑13700TE, TPM 2.0, 2x 2.5 GbE, 2x16 GB DDR4 2666, 256 GB M.2 SATA SSD, Wi‑Fi/BT 5.1

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