Thermally Conductive Encapsulating & Potting Compound are manufactured with a blend of low viscosity and inflaming retarding materials to provide curing at room temperature and high temperature (the latter can decrease the cure time). Since no by-products are generated during the compound's curing reaction, the compound is suitable for use in the surface of various materials such as PC(Poly-carbonate), PP, ABS, PVC. They are also primarily suitable for electronic parts for heat conducting, insulating, waterproofing and inflaming retarding. The compounds can achieve UL94-V0 and be RoHS compliant absolutely.
The compounds offer several benefits that include excellent conductivity and flammability, low viscosity, excellent levelling property, cured soft rubber-like materials with excellent impact resistance, good heat resistance, moisture resistance, cold resistance, good chemical properties such as insulated, moisture-proof, seismic resistance, corona resistance, antileakage, excellent adhesive power. the compounds find typical application in power module, electron component deep section cure and special for HID power module cure