- Electricity - Electronics
- Electronic Component
- Thermally conductive gap filler
- Shenzhen HFC Co.,Ltd
Thermally conductive gap filler H series
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Description
The H series, which is manufactured by Shenzhen HFC Shielding, is a thermal pad that is ideal for use in power conversion components, in high-speed disk storage drives, and in engine control units. The series has an adequate compression rate with a thermal conductivity of 1.0 W/m.k and complies with the UL94 V-0 standard.
Catalogs
Thermal interface materials
24 Pages
Thermal gap filler
29 Pages
Other Shenzhen HFC Co.,Ltd products
Thermal Interface Materials
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.