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Brush cleaning equipment automaticfor wafers
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Characteristics
- Technology
- brush
- Operational mode
- automatic
- Applications
- for wafers
Description
·Top/Back side clean，Force down Brush，Bevel brush，Megasonic clean，HPC clean， Nano clean，SC1-Nano clean.
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Semiconductor Equipment Series
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.