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- Metal polishing machine
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Metal polishing machine industrial
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Characteristics
- Machined material
- for metals
- Domain
- industrial
Description
·Throughput: 600pcs/batch,14400pcs/h(210mm wafer)；720pcs/batch,17280pcs/h(182mm wafer);
·Process bath circulation volume adjustable;
·Uniform pyramids texture,etch depth adjustable;
·Wafer thickness down to 120um;
·With clean dry area and self-clean dry system;
·Low H2O2 consumption;
·Quick inline bath change;
·Available with MES,RFID system,inline weight testing optional.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.