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Immersion cleaning equipment RCAautomaticfor wafers
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Characteristics
- Technology
- immersion
- Operational mode
- automatic
- Applications
- for wafers
Description
· Throughput: 400pcs/batch, 9600pcs/h(210mm wafer),480pcs/batch, 12000pcs/h (182mm wafer).
· Various additive technologies available.
· Wafer thickness down to 120μm.
· With dry clean area and self-cleaning system.
· Quick inline bath change.
· Available with MES, RFID system, inline weight testing optional.
Other Shenzhen S.C New Energy Technology Corporation products
Wet Chemical Equipment Series
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.