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PECVD deposition machine thin-film
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Characteristics
- Method
- PECVD
- Deposition type
- thin-film
Description
·Quick RF ignition with least reflect power for uniform and stable film deposition;
·Matured and stable multi-feed in RF technology compatible for even large process chamber;
·Continuous adjustable gas between diffuser and substrate providing flexible process possibilities;
·High throughput with relative low cost, with capability of customized product design;
·Modularized design for easy installation and maintenance, together with highest safety protocol from design to fabrication.
Other Shenzhen S.C New Energy Technology Corporation products
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.