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Water cleaning equipment SC-CSZJ9600E-20F
dryprocessfor wafers

Water cleaning equipment - SC-CSZJ9600E-20F - Shenzhen S.C New Energy Technology Corporation - dry / process / for wafers
Water cleaning equipment - SC-CSZJ9600E-20F - Shenzhen S.C New Energy Technology Corporation - dry / process / for wafers
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Characteristics

Technology
water, dry
Applications
process, for wafers

Description

Used for wrap around removal & cleaning of the diffused silicon wafers. Process Flow Wrap Around Removal→Post-clean→Acid Clean→Post-clean→Acid Clean→Hot Water Drying→Drying (for reference) • Throughput: 400pcs/batch, 9600pcs/h(210mm wafer),480pcs/batch, 12000pcs/h (182mm wafer). • Various additive technologies available. • Wafer thickness down to 120μm. • With dry clean area and self-cleaning system. • Quick inline bath change. • Available with MES, RFID system, inline weight testing optional.

Exhibitions

Meet this supplier at the following exhibition(s):

Intersolar 2026
Intersolar 2026

23-25 Jun 2026 Munich (Germany) Hall A2 - Stand 510

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.