X-ray photoelectron spectrometer AXIS Supra+

laboratoryfor the semiconductor industryfor spectroscopy

Overview
The AXIS Supra+ is an imaging X‑Ray Photoelectron Spectrometer (XPS) that provides quantitative elemental and chemical state information from the uppermost ~10 nm of a material's surface. Also marketed as Kratos Ultra 2 in Japan, the AXIS Supra+ combines spectroscopic and parallel imaging capabilities with advanced automation to support routine and research surface analysis across metals, semiconductors and insulators.

Key Features

• Sensitivity: Excellent sensitivity in spectroscopy and XPS imaging modes for trace and surface analysis.
• Usability: ESCApe software integrates acquisition, processing and automation for streamlined workflows.
• Parallel XPS imaging: Fast, high‑spatial‑resolution imaging to map lateral distribution of elements and chemical states.
• Resolution: High spectroscopic and imaging resolution suitable for detailed surface chemistry studies.
• Automation: Extensive automation of spectrometer functions to increase throughput and repeatability.
• Additional techniques: Modular platform configurable with complementary surface analysis and preparation options without degrading XPS performance.

Applications

• Batteries and power storage materials analysis.
• Hard X‑ray photoelectron spectroscopy (HAXPES) related studies.
• Coatings and thin‑film characterization.
• UPS‑XPS depth profiling of OLED and other thin films using argon cluster sputtering.
• Layer composition quantification in compound semiconductors and multilayer materials.

Documents available (selected application notes)

• Combined argon cluster UPS‑XPS depth profile of OLED thin‑film (application note).
• Quantification of layer composition in compound semiconductors (application note).
• Eliminating core line/Auger peak overlap using different photon energies (application note).

Technical specifications

• Brand: Shimadzu
• Model: AXIS Supra+
• Also known as: Kratos Ultra 2 (Japan)
• Type: Imaging X‑Ray Photoelectron Spectrometer (XPS)
• Analysis depth: uppermost ~10 nm of the surface
• Techniques: XPS with spectroscopic and parallel imaging modes; supports UPS‑XPS depth profiling with argon cluster sputtering
• Imaging: High spatial‑resolution parallel XPS imaging for lateral chemical mapping
• Sensitivity & resolution: Designed for excellent sensitivity and high spectroscopic/imaging resolution
• Software: ESCApe for integrated acquisition, processing and automation control
• Sample compatibility: Metals, semiconductors, insulators and various thin films/coatings
• Modularity: Configurable with additional surface analysis and preparation options without compromising XPS performance