High and low temperature test chamber, customized expansion force acquisition module placement device.
It is used to simulate products under the combined conditions of temperature and humidity in climate environment (high and low temperature operation, storage, temperature cycle, high temperature and high humidity, low temperature and low humidity, dew test, etc.). It is suitable for aerospace products, information electronic instruments, materials, electrical, electronic products, all kinds of electronic components in high and low temperature to test its various performance indicators.
Temperature range: -20℃~100℃
External dimensions: W2350mmD1750mm*H2100mm
Internal dimensions: W1400mm*D650mm*H1800mm
Volume: 1638L