Heat sink enclosure AWA series
for desktop computersmodularextruded aluminum

heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
heat sink enclosure
Add to favorites
Compare this product
 

Characteristics

Construction
for desktop computers
Configuration
modular
Material
extruded aluminum
Application
for measuring devices, for amplifiers, for PC
Protection level
IP40
Other characteristics
heat sink
Width

Max.: 202 mm
(8 in)

Min.: 52 mm
(2 in)

Height

Max.: 77 mm
(3 in)

Min.: 32 mm
(1.3 in)

Depth

Max.: 294 mm
(11.6 in)

Min.: 53 mm
(2.1 in)

Description

Technical Data Protection class: IP40 Operating temperature: -40°C ~ +105°C Recommended torque: 1.0N • m (10kgf • cm) ■ Extruded aluminium frame manufactured with heat-sink sides. ■ Silver anodized end panels makes for a luxurious finish. ■ Conductivity is achieved by utilizing the contact between the unfinished end panels backside and inside of the frame. ■ PCB or chassis can be horizontally mounted by sliding into an inner-grooved body frame. ■ Suitable for industrial fanless PC, measuring instrument, digital audio amplifier and so on. ※Thermal resistance test condition • Ambient air cooling • Heat-sink fins are set perpendicular to the ground with temperature at 60°C. • Anodized aluminium extrusion • Heat source is applied on the opposite side (inner side) of the fins.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.