Industrial camera Linea™ HS 16k

3Dmachine visioninspection

Waterloo, CANADA, October 12, 2021 – Teledyne DALSA is pleased to announce that its Linea™ HS 16k Multifield TDI camera is in volume production. The Linea HS 16k Multifield can capture up to three images simultaneously in a single scan using light sources at different wavelengths. Its charge-domain CMOS TDI sensor with 16k x (64+128+64) TDI arrays and a 5x5 μm pixel size, uses advanced wafer-level coated dichroic filters with minimal spectral crosstalk to spectrally isolate the three images. The camera also comes with high-speed CLHS interface, delivering up to 8.4 Gigapixels per second over a single and long length fiber optic cable. “Advanced multifield imaging technology is what differentiates the Linea HS 16k Multifield camera from other line scan cameras,” said Xing-Fei He, Senior Product Manager, Teledyne DALSA. “The dichroic filters overcome spectral crosstalk of traditional color filters and enable image isolation within the spectral domain.” The Linea HS 16k Multifield camera significantly improves inspection speeds and image quality. It eliminates the need for multiple scans, thereby boosting inspection system throughput and improving detectability with minimum impact from mechanical vibration. The Linea HS is ideally suited for applications such as inspection of flat panel displays, printed circuit boards (PCB), and semi-conductor wafers; web inspection of film and metal foil; general purpose machine vision and life science applications. The camera can also be used for color imaging with a white light source. The spectral characteristics of dichroic filters provide unique color representation that can be used to improve detectability.