Diamond powder SMD

tungsten carbidefor polishingabrasive

Overview
Achieves unprecedented nano-order surfaces (Ra < 0.0005 µm) and gloss values (> 1000) on hard, brittle, and highly ductile materials without chipping or denting complex 3D geometries.

Key Features & Benefits

• Extreme Surface Quality (Ra < 0.0005 µm, Gloss > 1000): Ultrafine diamond abrasive particles deliver ultra-mirror gloss on high-hardness cutting tools and tungsten carbide.
• Chipping-Free on Hard & Brittle Materials: Natural walnut shell carrier absorbs impact, allowing chip-free precision finishing on hard, brittle substrates (quartz glass, carbide).
• Dent-Free on Ductile Materials: Polishing mechanism prevents surface indentation and scratch marks on highly ductile alloys (titanium, brass).
• 3D Complex Geometry Coverage: Reaches deep into tiny crevices, intricate shapes, and curved edges for uniform edge-to-edge mirror finishes.

Target Applications
Cutting tools (carbide/HSS), medical implants (artificial bones), turbine blades, bearings, HDD parts, quartz glass, titanium components, fine jewelry