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Manual packaging machine SDV series
vacuumfor electronicswith sealing

manual packaging machine
manual packaging machine
manual packaging machine
manual packaging machine
manual packaging machine
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Characteristics

Operational mode
manual
Type
vacuum
Domain
for electronics
Other characteristics
with sealing

Description

Totech SDV vacuum packaging machines are particularly suitable for use in ESD protected areas. The primary use of our vacuum sealing machines is for the electronics market to seal all types of moisture sensitive electronic products and components including SMDs, semiconductors, microchips, memory chips, sub panels, motherboards, PLC’s & RAM. The controlled reduction of humidity and oxygen content ensures secure storage and transport conditions Features • - Deep-drawn stainless steel vacuum chamber • - Antistatic acrylic glass cover • - Double seam welding • - High-pressure sealing systems • - Inserts for level adjustment • - Z-3000 sensor control • - 99 Program memory slots • - Service function • - Key lock, fast-stop and step vacuum functions • - Shipped with initial equipment • - Quality Busch vacuum pump • - Cordless sealing systems Options • - Shielding gas unit • - Additional sealing systems • - Trolley frame with bag tray

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.