Reflow soldering machine RSS-210-S
semi-automatic

reflow soldering machine
reflow soldering machine
reflow soldering machine
reflow soldering machine
reflow soldering machine
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Characteristics

Technique
reflow
Operating mode
semi-automatic
Power

7,000 W, 9,000 W

Description

Vacuum Reflow Solder System The RSS-210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas. The reflow solder system is perfect for the following applications: flux-less soldering flip chip process adhesive bonding solder bump reflowing encapsulation of housings soldering of power devices heat treatment of semiconductor wafers prototype development quality control Technical Data: heated area: 210 mm x 210 mm (= model RSS-110-S) chamber height: 60 mm (optional up to 80 mm) viewing window with 60 mm dia. Mass Flow controller for Nitrogen (5 nlm) vacuum atmosphere up to 10exp.-3 hPa (KF16 connector) temperature up to 400 °C (optional up to 500 °C) ramp up rate: better 240 K/minute ramp down rate: better 120 K/minute SIMATIC© process control with 50 programs and 50 steps each 7" touch panel water cooled chamber (controlled and watched) electrical connection type: 230V, 9 kW or 115V, 7 kW

Catalogs

RSS-210-S
RSS-210-S
4 Pages
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.