3D laser processing machine Ultratech LSA 101

LSA101 Laser Spike Anneal System Utilized by leading IDMs and foundries around the globe, Veeco’s LSA101 Ultratech System is utilized as the preferred technology for high-volume manufacturing of advanced logic devices from the 40nm to 14nm nodes. Built on the customizable Unity Platform™, the LSA’s scanning system has fundamental advantages in uniformity and low-stress processing, which make it readily applicable for current and future device nodes. The LSA101 system enables critical millisecond annealing applications that allow customers to maintain high processing temperatures, and thus achieve improved device performance, lower leakage, and higher yield. The standard LSA101 configuration utilizes a single narrow laser beam to heat the wafer surface from substrate temperature to the peak annealing temperature. An LSA dual beam technology was developed to expand the application space of non-melt laser annealing and features a second low-power laser beam to enable low-temperature processing. When using dual beam a second wider laser beam is incorporated to preheat the wafer. The dual beam system offers flexibility in tuning the temperature and stress profiles.