3D laser processing machine Ultratech LSA 201

LSA201 Ambient Control Laser Spike Anneal System Veeco’s LSA201 Laser Spike Annealing (LSA) System has the same architecture as the LSA101 but includes a patented micro chamber design which enables full-wafer ambient control in a scanning laser system. The micro chamber is unique in that it does not require the use of a vacuum load-lock. The system is capable of running mixtures of any inert gases including forming gas. The LSA201 targets applications such as high k metal gate junction activation and nickel silicide formation. The LSA201 is well suited for processes at sub-20nm, such as interface engineering and material modification where ambient control is critical. Key Features Long wavelength, Brewster angle, p-polarized light for optimum within-die uniformity Closed-loop temperature feedback control to maintain tight temperature control Layout independent design ideal for processing both planer and FinFET devices Localized stress field with flexible dwell time enables low stress processing and reduced wafer breakage