The iS6059 system rapidly checks that electronic components are in place, takes exact measurements of the heights on an assembly and inspects solder joints with high reliability. Nine views in first-class resolution and 26% more pixels, variable illumination, larger angled image fields with the same resolution, even further increased data transfer rates combined with 25% faster image capture and extensive networking options provide a solid basis for unbeatable line-integrated performance. Processes can be significantly improved and returns consistently avoided. Manufacturing costs can be trimmed in the long term and the high quality of even very sophisticated electronic products can be ensured.
• Uncompromisingly good imaging thanks to state-of-the-art sensor technology
• High resolution for the precise inspection of microscopic components
• Large angled views for the most accurate analyses
• Smart verification with optional AI integration
• Intuitively simple operation and creation of inspection programs
• Fast data processing with powerful frame grabber
• Extremely fast handling of the inspection objects
• Expert service worldwide – online, by phone and on site