Camera inspection system iS6059

optical3D2D

With innovative 3D camera technology, the iS6059 Double-Sided Inspection 3D-AOI system inspects THT components, THT solder joints, press-fit and SMD components shadow-free and at high precision on the upperside and underside of the printed circuit board. The products are inspected at high speed in 2D, 2½D and 3D. As a result, the iS6059 Double-Sided Inspection stands for maximum defect detection and highest throughput. Different lighting can be used flexibly and so provide inspection results in excellent quality. • A convincing concept: two powerful 3D XM sensor modules for simultaneous quality inspection from above and from below • First-rate inspection quality: Shadow-free inspection thanks to 2x8 angled cameras • System flexibility: reliable handling of a wide range of different inspection objects • Verified zero defect slippage thanks to integrated verification • Minimal time and training requirements thanks to Viscom standard software • Reduction of cycle times thanks to inspection from both sides CONNECTIVITY • Global libraries, global calibration: Transferability to all systems • Outstanding inspection program optimization thanks to flexible single and multiline verification solutions • Simple operation and inspection program generation with vVision • High-performance OCR software • Connection via horizontal interfaces along the production line