Camera inspection system X7056-II BO

X-rayoptical3D

Viscom’s new bond inspection system offers an ideal solution for the increasing demand for X-ray inspection in the bond area. The X7056-II BO is ideal for installation in final assembly for power electronics, circuits, sensor construction and packaging to ensure 100% quality control. The inline system effectively combines optical wire bond control with X-ray inspection. Working on this basis, the unique X7056-II BO combined system ensures comprehensive inspection of power semiconductors and encapsulated sensor elements alike. The high-resolution camera system ensures absolutely reliable inspection of all bond sites and wires, and open and concealed connection points. Enclosed wire bonds and concealed solder joints underneath chips are also reliably inspected. The combined AOI and AXI bond inspection ensures extremely fast cycle times at maximum inspection depth. • Outstanding solder joint inspection on power semiconductors • High-precision inspection of single or double-sided electronic assemblies • Maximum inspection program optimization through integrated verification • Additional vertical slices for optimum analyses and dependable verification CONNECTIVITY • Global libraries, global calibration: transferability to all systems • Automated grayscale value calibration for consistent inspection results • Traceability, statistical process control, offline programming, multiline verification • Viscom Quality Uplink: effective networking and process optimization