Inspection software PlanarCT
printed circuitfor electronic componentsfor NDT

inspection software
inspection software
inspection software
inspection software
inspection software
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Characteristics

Function
inspection
Applications
printed circuit, for electronic components, for NDT
Type
real-time
Operating system
Windows

Description

High resolving slice or multi-slice inspections without overlaying structures Waygate Technologies' PlanarCT module enables users of the Phoenix Microme|x and Nanome|x X-ray inspection systems to perform better and more reliable inspection of solder joints and packages in complex printed circuit board assemblies. Perform better and more reliable inspection of solder joints and packages in complex printed circuit board assemblies Performing a PlanarCT scan is easy to adjust without any sample preparation of fixing in a rotation stage. The board is just placed on the manipulation table and the region of interest scanned while the table rotates. The reconstructed planarCT slice or multislice views allow exact inspection results of a single plane or a whole package of interest without overlaying structures from other board areas. Waygate Technologies' included 3D|viewer also allows full volume evaluation tasks. PlanarCT is not just an excellent inspection method for printed circuit boards, but also for ROI inspection of large flat samples such as composites and additive manufactured parts enabling users to perform high resolving slice or multi-slice inspections without overlaying structures.

Exhibitions

Meet this supplier at the following exhibition(s):

36th Control 2024
36th Control 2024

23-26 Apr 2024 Stuttgart (Germany)

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    20th WCNDT 2024 - KOREA
    20th WCNDT 2024 - KOREA

    27 Apr - 31 May 2024 Incheon (South Korea)

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.