RFI shielding SnapShot®

EMIboard levelRF

The electronic devices are getting smaller by the day, and as a result, PCB designs are getting increasingly miniature and complex. Furthermore, with the demand for wireless devices increasing, electromagnetic and radio frequency interference (EMI/RFI) is becoming a concern for PCB designers. This EMI/RFI may affect everything from components to PCBs. Needless to say, all these devices require a board level EMI RF shielding to achieve their optimum performance while complying with governmental regulations. XGR Technologies SnapShot EMI shields are revolutionary, multi-cavity shields that solve many of the problems and challenges associated with today’s board level shielding (BLS) technologies. Originally developed by W.L.Gore & Associates, XGR Technologies has acquired all assets related to the SnapShot® board level EMI shielding business. These board level shields were launched in 2002 and have been successfully used in military radios, drones, avionics, GPS devices, industrial handheld scanners, medical imaging equipment, and network computing for over 20 years. SnapShot® board level EMI shields consist of a lightweight, metallized plastic material that is thermoformed into virtually any design. The shields have a non-conductive, polyetherimide inner surface and conductive, tin plated outer surface resulting in exceptional shielding performance in an ultra-lightweight and low profile solution. Superior Shielding Effectiveness SnapShot® board level shields provide superior shielding effectiveness when compared to traditional frame and lid style EMI shields.