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Circuit board shielding
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{{/each}}
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{{/each}}
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Two-piece Drawn-Seamless RF Shield/EMI Shield COVER Item Configuration - 2-piece EMI/RFI Shield COVER Ventilation - Non-Vented Mounting Type - Snap Fit to FRAME Raw Material - Tin-Steel (CRS)
Masach Tech

Two-piece Drawn-Seamless RF Shield/EMI Shield FRAME Item Configuration - 2-piece EMI/RFI Shield FRAME Ventilation - Non-Vented Mounting Type - SMD/SMT Soldering Raw Material - Tin-Steel (CRS)
Masach Tech

Two-piece Drawn-Seamless RF Shield/EMI Shield COVER Item Configuration - 2-piece EMI/RFI Shield COVER Ventilation - Non-Vented Mounting Type - Snap Fit to FRAME Raw Material - Tin-Steel (CRS)
Masach Tech


... Variable shield heights of 6,00 mm, 12,00 mm or 18,00 mm Quick & easy shielding solution; Shields are ready to use; no tooling needed Nickel-Silver material offer excellent shielding and solderability ...
MPE-GARRY

... design and production of board level shielding. The photoetching process allows the fabrication of parts with complex shapes and features that are impossible to duplicate by other methods without expensive ...

... associated with today’s board level shielding (BLS) technologies. Originally developed by W.L.Gore & Associates, XGR Technologies has acquired all assets related to the SnapShot® board ...
XGR Technologies

SnapShot board level EMI shield technology offers the lowest profile board level shield available on the market today. SnapShot EMI shields are manufactured from a proprietary material comprised of ...
XGR Technologies

... that are soldered on the back side of the board as these pins protrude through vias or through holes. The advantages of one-piece board level shields is that they can provide a high level of EMI/RFI ...
XGR Technologies

... Description The shielding clip is a surface-mounted product for an alternative and economical solution to shielding belts. The clip can be welded or tighten anywhere on the PCB, for a consequent space ...

... solution, where the shield is soldered on to the circuit board directly Customised shielding combined with standard clips, where the shielding can be manually attached ...

MAGIELD® magnetic shielding sheets are classified as amorphous shielding sheets and nanocrystalline shielding sheets according to different kinds of soft magnetic materials. MAGIELD® ...

OVERVIEW Electromagnetic wave shielding cover is a media to block the radiation emitting inside and outside. This is mainly applied in mobile phone and GPS, eliminating the electromagnetic interference, which are emitted ...
YAN SHIN PRECISE CO.,LTD

Custom designed shielding cans are manufactured by photo etching or stamping, which is then folded and soldered or tabbed to form a continuous shield. They can have a removable or a fixed integral lid and they are then ...

1500 series Clip-on EMI shielding cans for printed circuit board EMI/RFI shielding and screening cans/covers for printed circuit ...
Holland Shielding Systems BV
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