● Meet AEC-Q101 requirement
● Low incremental surge resistance
● Excellent clamping capability
● Low profile package with built-in strain relief
● Typical IR less than 1.0 μA above 12 V
● 400 W peak pulse power capability with a 10/1000 μS Waveform, repetition rate (duty cycle): 0.01%
● For surface mounted applications to optimize board space
● Typical failure mode is short from over-specified voltage or current
● IEC 61000-4-2 ESD 30 kV (Air), 30 kV (Contact)
● EFT protection of data lines in accordance with IEC 61000-4-4
● Very fast response time
● Glass passivated chip junction
● High temperature to reflow soldering guaranteed: 260 °C/40 sec
● VBR@TJ=VBR@25°Cx(1+α Tx(TJ-25)) (αT: Temperature Coefficient, typical value is 0.1%)
● Plastic package is flammability rated V-0 per Underwriters Laboratories
● Meet MSL level1, per J-STD-020
● Matte tin lead–free plated
● Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD-609A.01)
● Halogen free and RoHS compliant