3D profiler APM650

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ZYGO®’s APM650™ packaging metrology system is a new inspection tool designed for automated measurement of panel-based PCBs and other modern packaging applications. It offers 2D and 3D measurements for several surface features, with sub-nanometer vertical precision and sub-micron lateral precision At the core of the APM650™ system, Coherence Scanning Interferometry (CSI) is the measurement technology. This non-contact technique offers high-precision and high-value surface metrology benefits, including: - Sub-nanometer measurement precision is independent of field magnification - Measures nearly all types of surfaces; from rough to exremely smooth, such as thin films, steep slopes, and large steps - SureScan™ vibration tolerance technology - strong operation in almost any environment - Gage capable performance - outstanding precision and repeatability for highly challenging production applications - Mx™ software enables seamless data exchange with other ZYGO® Profilers, including Nexview™, ZeGage™, and NewView™ 8000