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... The award-winning mPower solution provides power integrity analysis for digital, analog, and 3D IC across all design flows at any scale. Analog, semi-custom, and digital power integrity analysis can be readily integrated into existing ...
SIEMENS EDA
... -Die, System-Level Alignment/Connectivity Checks The Calibre 3DSTACK tool extends Calibre die-level signoff verification to complete signoff verification of a wide range of 2.5 D and 3D stacked die ...
SIEMENS EDA
... mixed-signal and custom IC designs. Solido SPICE Accelerated SPICE simulation for next-generation AMS, RF, memory, and 3D IC designs Solido FastSPICE Accelerated FastSPICE simulation for SoC and memory designs Solido LibSPICE Accelerated ...
SIEMENS EDA
... Heterogeneous and homogeneous 2.5/ 3 D IC Package Connectivity Planning, assembly prototyping, & system technology co-optimization. 2.5/ 3 D IC Package Planning & Prototyping Early ...
SIEMENS EDA
... signoff for various integration technologies such as FCBGA, FOWLP, 2.5/ 3 D IC, and others. Our 3D IC packaging solutions help you overcome the limitations of monolithic scaling. What is 3D ...
SIEMENS EDA
... . Physical Implementation & Manufacturing Handoff Signal integrity/PDN issues are found, investigated, and validated. 3D thermal modeling and analysis predicts airflow and heat transfer in and around electronic systems. Package ...
SIEMENS EDA
... Support Design and verify complex SiP modules in a fully supported 3D design environment. Simultaneous 2 D/ 3 D editing and DRC all within a single design tool that easily detects and ...
SIEMENS EDA
... HyperLynx family includes all the tools you need for complex signal integrity analysis – expert-based design rule checking, 2 D and 3D electromagnetic modeling, standards-based, protocol-aware simulation & comprehensive ...
SIEMENS EDA
... efficient, well-integrated flow. Full-Wave Electromagnetic Solver High-capacity, scalable EM solver addresses broadband 3D modeling needs. ...
SIEMENS EDA
Power integrity is one of the biggest problems in electronic product design. Modern ICs, digital and analog alike, require multiple supply voltages to operate. HyperLynx DC Drop provides simulation results within seconds. , Accelerates product design, ...
SIEMENS EDA