Photo-initiated curing epoxy adhesive DELO

one-component epoxy resins
curing is triggered by UV or visible light
(see "curing lamps DELOLUX")
Preactivation and curing within seconds result in:
rapid and secure bonding even of non-transparent
components
shortest cycle times
rapid further processing
Dam & fill® products for smart cards
This protects the sensitive chips. Fixing soldered contacts of electronic components
The adhesive provides secure protection against unsoldering and strong shocks

Properties DELO-KATIOBOND:
dry surface
outstanding ahdesion on different materials
good tension-equalizing behaviour
low-viscous to pasty
Application areas:
Micro-electronics
Electronics / electrical engineering
Automotive supplier industry
Smart Card industry
Plastic processing
You can find detailed information about radiation curing in our
brochure „Radiation curing“

More specifications...