Laser PCB etching machine Fusion3D 1100

for printed circuits

LPKF Fusion3D 1100 Economical entry into Laser Direct Structuring (LDS) Flexible, compact, suitable for laboratory use Proven Fusion3D platform For prototypes and small series production New products for the electronics industry Smaller, more complex, more compact: Modern electronic devices challenge manufacturers with difficult tasks. MID components provide a solution. This turns simple plastic components into high-quality 3D circuit carriers. The LPKF Fusion3D 1100 opens an economical way into this technology - for small series or 3D prototyping. From a simple plastic clip to a smartphone antenna: The LPKF LDS process leads to new product designs. Conductor tracks grow on a plastic component and it becomes a 3D circuit carrier. The LDS process opens up new, economical forms of production - from individual components to mass production. Because more and more functions are accommodated in ever smaller spaces, components that were previously used purely mechanically also have to assume electronic functions: Plastic clips, frame elements or housing parts are promising examples. These three-dimensional circuit carriers are based on injection molded parts. They are referred to as molded interconnect devices (MIDs). Laser Direct Structuring (LDS) has achieved a large market share among MID manufacturing processes. A big part of the smartphones today have an LDS component. Other markets are the automotive industry, medical technology and the consumer sector. The LPKF Fusion3D 1100 represents a cost-effective and flexible entry into this growing technology.