Chip encapsulation compound Master Bond

Master Bond manufactures an extensive line of chip encapsulation compounds and other specialty electronic encapsulation systems designed to meet the diverse needs of the microelectronics industry. These electronic grade adhesive products are currently employed in applications ranging from glob tops to surface mounting to BGA underfills, potting and heat sinking. Many of our compounds have unique properties such as low thermal expansion coefficients, exceptionally high thermal conductivity, low stress, etc.

Die attach adhesives for chip-on-board assemblies offer outstanding bonding strength for adhering components directly onto printed circuitry. Their dimensional stability is remarkable, even upon prolonged exposure to adverse environmental conditions.

Master Bond has one component epoxy underfill compositions which feature rapid cures of 10-15 minutes at moderately elevated temperatures and offer excellent underfill-to-die passivation.

Epoxy underfills contains low viscosity, highly flowable compounds that produce uniform void-free epoxy layers for enhancing the protection of the active die surfaces and improve stress distribution away from solder interconnects. Master Bond, has formulated no flow fluxing underfill whose use greatly simplifies conventional flip chip assemblies, some of which can be fully cured during standard reflux cycles in-line processing.

Master Bond provides prompt personalized "one-on-one" technical assistance and will be glad to answer any questions you may have. We have over three decades of experience in solving technical problems.

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