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Working temperature: -73 °C - 204 °C
Polymerization time: 1 h - 6 h
... for efficient heat transfer
Applications
- Bonding
- Sealing
- Coating
- Gap filling
Certifications & Compliance
- Meets
Master Bond
... cyanoacrylate type adhesive. This high strength, rapid curing system is used primarily for medical device assembly. MB297Med is a higher viscosity (2,200-2,400 cps) cyanoacrylate. This kind of system, which is commonly referred to as ...
Master Bond
... Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical insulator * Low exotherm * High ...
Master Bond
... Key Features - Low viscosity - Minimal shrinkage upon curing - Superb optical clarity - Cures at 80°C in shadowed out areas Master Bond UV22DC80-1 is a nanosilica filled, dual cure epoxy based system. It is formulated to cure readily upon exposure ...
Master Bond
... Meets NASA low outgassing specification Master Bond EP42-2LV Black is a room temperature curable, two component epoxy for bonding, sealing, coating and casting featuring very good chemical and temperature resistance. This lower viscosity ...
Master Bond
Working temperature: -80 °F - 400 °F
... syringes and can be applied without any tailing. Primarily, it is formulated for use as a die attach and special purpose bonding material. It is serviceable from -80°F to +400°F (-60°C to +200°C). ...
Master Bond
... Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. It combines convenient processing with superior strength properties ...
Master Bond
Working temperature: -80 °F - 450 °F
... EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good strength properties. ...
Master Bond
Working temperature: -60 °C - 175 °C
... glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications ...
Master Bond
Working temperature: -60 °F - 400 °F
... Two component epoxy adhesive, sealant and coating featuring exceptional resistance to acids Key Features * Paste consistency * Convenient handling * Superior temperature resistance * Good physical strength properties EP21ARHTND-2 ...
Master Bond