Chip encapsulation compound Supreme3HTND-2GT
Master Bond
Master Bond Polymer System Supreme 3HTND2GT is a fast curing, toughened one component high performance epoxy adhesive/sealant which meets the growing need for precise positioning and bonding of microelectronic components and other devices on printed circuit boards and other electronic assemblies. It meets the increasing need for technology capable of accurate assemblies and manufacturer of miniaturized electronic devices without soldering and other traditional methods. It offers remarkably high durable protection against adverse enviornmental conditions, vibration, impact and thermal shock for components on circuit boards including the more fragile and delicate ones. Additionally, Supreme 3HTND2GT has excellent electrical insulation properties, high physical strength characteristics and superior adhesion to metals, plastics and ceramics, as well as to flexible and rigid circuit board materials. Supreme 3HTND2GT can be easily applied to specific, sharply defined circuit board areas and will not flow during application or cure beyond the desired board section. The most important advantages over conventional two component glob top compounds include ease of application with no need for mixing, unlimited working life, very fast cure cycles, along with high insulation and strength properties. Supreme 3HTND2GT is 100% reactive and does not emit any volatiles during cure. The formulation is specially designed so that ionic impurities are negligible.
