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Epoxy adhesive
EP21TDCS Master Bond

Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the EP21TDCS has a one-to-one mix ratio, by weight or volume. It readily develops a high bonding strength of more than 850 psi tensile shear and a T-peel of greater than 10 pli when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is less than 10-3 ohm-cm.

Master Bond Polymer System EP21TDCS can be applied with minimal sagging or dripping even on vertical surfaces. It can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of 4K to +275°F enabling it to be serviceable even in cryogenic applications. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored silver. Master Bond EP21TDCS adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and other industries. For convenient handling, EP21TDCS is now available in premixed and frozen syringes. A heat resistant version called EP21TDCSHT is recommended for use up to 350°F.
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