Epoxy underfill compound / resin flip chip
EP3RRLV/EP30AO/EP37-3FLF Master Bond

Designed to improve reliability, Master Bond’s line of epoxy underfill compositions offer excellent underfill to die passivation as well as outstanding adhesion to a variety of substrates. They improve mechanical support, lower strain on solder joints and provide superior protection from moisture.
Applications for Epoxy Underfill Encapsulants

Flip chip devices
Ball grid arrays
Chip scale packaging

Advantages of Master Bond Underfill Systems

Both flowable and non-flow systems are available for use. Additionally, to improve efficiency of production snap cure and reworkable systems have been introduced. The key properties of theses systems include:

High purity
Low stress
High adhesion
Low coefficient of thermal expansion (CTE)
Low outgassing
High glass transition temperature (Tg)
High Young’s modulus
Moisture resistance
Short cure cycle
Structural stability
Thermal cycling resistance
Shock and vibration resistance