Potting and encapsulation resin EP30AO/EP30FL
Master Bond
Master Bond Inc. offers a broad line of potting and encapsulation materials designed to protect electronic circuitry and assemblies from potentially damaging conditions such as moisture, various corrosive chemicals, excessive heat, vibration, mechanical impact, thermal shocks and abrasion which might occur while the device is in operation. While the majority of the products offered are epoxies, including both rigid and flexible types, other systems are also available such as polyurethanes and silicone compounds. These systems include two part systems that cure at ambient temperatures or more quickly at elevated temperatures, as well as one part, no mix systems requiring elevated temperature cures. Master Bond's potting and encapsulation epoxies feature outstanding electrical insulation characteristics including high volume resistivity, excellent dielectric strength and low dielectric constants and dissipation factors. Some of the more specialized compounds include epoxies that are flame resistant, thermally conductive and cryogenically serviceable. Master Bond's technical staff will be glad to recommend the product best suited to your particular application's requirements.
