Soldering hot plate QK853ESD
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Characteristics
- Applications
- soldering
Description
Fast heat up, 10 seconds to reach 250°C.
● Built in temperature sensor for stable temperature control.
● Hot and cool air selection for chip preheating or cooling.
● Used together with a hot air rework station and fixture for BGA and other IC's.
● Power: 460W.
● Temperature: 120°C to 250°C(at nozzle).
● Air volume: 0.18 cubic meter/min.
● Size: 100(W) x60 (H) x170 (D) mm.
● Weight: 1kg.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.