TAKASAGO ELECTRIC, INC.

Film manifold
TAKASAGO ELECTRIC, INC.

The Film Manifold consists of several layers of resin film bonded together
in which fine channels are engraved. It is much smaller and lighter than
glass or resin block manifolds and can be used in microfluidic applications
such as chips or reactors. It is bendable and temperature control of the
channels is easy. Our miniature valves etc. can be mounted on the film
manifold.

Maximum dimensions: 250mm x 250mm
Material: Polyimide, Polyethylene naphthalate
Minimum channel width: 50 ìm
Available layer thickness: 25ìm, 50ìm, 75ìm
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standListOtherProduct www di En 2012-02-07-13