Film manifold TAKASAGO ELECTRIC

The Film Manifold consists of several layers of resin film bonded together

in which fine channels are engraved. It is much smaller and lighter than

glass or resin block manifolds and can be used in microfluidic applications

such as chips or reactors. It is bendable and temperature control of the

channels is easy. Our miniature valves etc. can be mounted on the film

manifold.


Maximum dimensions: 250mm x 250mm

Material: Polyimide, Polyethylene naphthalate

Minimum channel width: 50 ìm

Available layer thickness: 25ìm, 50ìm, 75ìm

More specifications...