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  1. Production Machines
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  3. Flip-chip die bonder
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Flip-chip die bonder AFM Series

Flip-chip die bonder - AFM Series - TDK Electronics Europe
Flip-chip die bonder - AFM Series - TDK Electronics Europe
Flip-chip die bonder - AFM Series - TDK Electronics Europe - image - 2
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Flip-chip die bonder - AFM Series - TDK Electronics Europe - image - 4
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Characteristics

Technology
flip-chip

Description

TDK uses its abundant experience and technology that it has accumulated to propose a new mounting method for the next generation. TDK is proud to introduce its new high-reliable, space-saving, low price equipment: AFM-15 Flip Chip Bonder (Ultrasonic Bonding Process). Low-energy bonding enables bonding with 30% to 50% less energy consumption than other companies' products

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