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Rotational speed: 3 rpm - 30 rpm
... wafer polishing machine series for use in the semiconductor industry. The new FLP Wafer 1700 nano is a wafer double-sided polishing machine. For the first time, chemically ...
Feinschleif-, Läpp- und
Power: 5 kW - 38.5 kW
Rotational speed: 800, 1,100, 600 rpm
The HIGH PRECISION twin-disc machine series is a unique series of machine tools with a high damping granite chassis. It acts as a know-how driver for maximising precision in all areas to do with precision ...
Feinschleif-, Läpp- und
Power: 37 kW
As these sanding machines have to meet different requirements than conventional standard machines, their design differs significantly. The machine concept is designed for multi-shift ...
Weber
Power: 160 kW
... Central control of all machine parameters External drives Available as a double-head Your advantages at a glance WEBER has developed three separate series for processing plate-shaped materials. ...
Weber
Double-side surface finishing machines with rotating plates are designed for production of high accuracy Plano and Parallel surfaces on large, medium and small sized components. TPM Series ...
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