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X travel: 280 mm
Y travel: 350 mm
Z travel: 260 mm
... Machine perfect holes and other features in seconds, thanks to the industry-leading ML-5 ultrafast Laser micromachining platform’s combination of part handling, motion control, and real-time positioning feedback. At the ...
GF Machining Solutions
... system, beam attenuator, shutter, beam analyser, power recorder Machine class 1 (I), FEMTO- LASER class 4 (IV) Dedicated multifunctional software Siemens 840 D SL, safety integrated CNC Machine at ...
Posalux SA
X travel: 600 mm
Y travel: 300 mm
Positioning accuracy: 0.002 mm
... microSTRUCT C is a highly flexible laser micromachining system predominantly used in product development and applied research. Because of its flexibility the system is perfectly suited for laser structuring, cutting, ...
3D Micromac
... industrial machines. Applications • Laser welding • Laser cutting • Laser drilling • Laser engraving • Laser texturing • Laser ...
Power: 500 kW
... 5μm Laser high-speed micro- machining is one of the indispensable, and widely used laser methods in micro-holes processing. With the reduction of the thickness of target ...
X travel: 500 mm
Y travel: 500 mm
Z travel: 300 mm
... Fast (USP) Femtosecond or Picosecond (IR, Green, UV) laser sources and up to 5-axis automation and movement sources with nanometric accuracy that allow to obtain excellent high-precision machining without altered thermal ...
Evlaser srl
X travel: 500 mm
Y travel: 300 mm
Z travel: 300 mm
... layout High-power laser doubled in visible light for rapid machining (femto 40W IR 400 µJ) Module for straight-sided micromachining Industrial vision system with shape recognition Intuitive man- machine ...
LASEA
Power: 5 W - 80 W
Weight: 116 kg
... range of laser micromachining applications, such as precision laser ablation and selective ablation, drilling, surface texturing, and marking. The small form factor and integration-ready design makes ...
... System The precSYS micromachining sub system enables laser micro processing and drilling of flexible geometries including laser cutting and structuring. Designed for ultra-short-pulse (USP) lasers, ...
... Principle of picosecond laser scribing (focus burst cutting in transparent material): Through the Bessel or DOE optical system, the Gaussian laser beam is compressed to the diffraction limit. Under the action of ...
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