Laser micro-machining machine microSTRUCT Ccuttingdrillingwelding
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Characteristics
- Type
- laser
- Associated functions
- cutting, drilling, welding
- X travel
600 mm
(23.62 in)- Y travel
300 mm
(11.81 in)- Positioning accuracy
0.002 mm
(0.00008 in)- Repeatability
0.001 mm
(0.00004 in)- Weight
3.5 t
(3.86 us ton)
Description
3D-Micromac‘s microSTRUCT C is a highly flexible laser micromachining system predominantly used in product development and applied research. Because of its flexibility the system is perfectly suited for laser structuring, cutting, drilling and welding applications of different kinds of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin film compound systems.
The microSTRUCT C is available as standardized laser system with three standard configuration packages. Its open system concept allows the integration of two independent and free configurable working areas and up to two laser sources simultaneously. Hereby the customer can choose from a pool of various laser source models.
Catalogs
microSTRUCT CTM
4 Pages
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.