Metalworking adhesives

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4 companies | 7 products
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epoxy adhesive
epoxy adhesive
Supreme 10HT

Working temperature: 440 °F

Key Features  - No mix, single component system  - Serviceability from 4K to +400°F  - Unlimited working life at room temperature  - Resistance to mechanical and thermal shocks  - NASA low outgassing approved  - Withstands ...

epoxy adhesive
epoxy adhesive
DELO-DUOPOX

... -component epoxy adhesive with excellent strength DELO offers a range of 2-component adhesives made from epoxy resin: This is a variety of glues that includes super-quick curing 2-part ...

cyanoacrylate adhesive
cyanoacrylate adhesive
DM-6674

Working temperature: -55 °C - 150 °C

DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, ...

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Shenzhen DeepMaterial Technologies Co., Ltd
optical lens adhesive
optical lens adhesive
DM-6434

... curing adhesive is a one-component solvent-free product, which can be cured in a few seconds under UV or visible light. It has a fast curing speed, high bonding strength, large curing depth, good toughness, and anti-yellowing.Lens ...

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Shenzhen DeepMaterial Technologies Co., Ltd
polyurethane adhesive
polyurethane adhesive
DM-6596

Working temperature: -40 °C - 80 °C

Hot melt adhesives exist in solid form and are classified by different types of raw materials. Polyurethane (Polyurethane Hot Melt Adhesive) is a reactive type of hot melt adhesive for ...

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Shenzhen DeepMaterial Technologies Co., Ltd
fast curing adhesive
fast curing adhesive
DM-6530

Working temperature: -40 °C - 80 °C

Hot melt adhesives exist in solid form and are classified by different types of raw materials. Polyurethane (Polyurethane Hot Melt Adhesive) is a reactive type of hot melt adhesive for ...

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Shenzhen DeepMaterial Technologies Co., Ltd
epoxy adhesive
epoxy adhesive
CHO-BOND® 584-29

Working temperature: -55 °C - 125 °C

Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required. CHO-BOND® 584-29 is a silver-colored epoxy designed ...

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